Abstract: In this paper, we present the application of the novel fluxfree soldering process for assembly of standard SMD components on a PCB. A standard SAC305 (Sn-3.0Ag-0.5Cu) type 3 powder is mixed ...
Abstract: This study uses surface-mounted devices (SMD) and 3D-printed components to rapidly produce high voltage RC dividers while meeting standardized design criteria for application in power ...
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