New Electronics

Siemens working with TSMC to accelerate 3D IC and AI-driven circuit and systems design

Siemens and TSMC deliver new certifications and design solutions for the foundry’s most advanced process technologies.
Electronic Specifier

Siemens and TSMC collaborating on certification and design solutions

At the 2025 TSMC North America Open Innovation Platform Ecosystem Forum, Siemens Digital Industries Software announced ...
Design-Reuse

Implementation of Metal ECO using Mask Programmable Cell for Hold Timing Violations

Day by day, technology continues to shrink while the transistor counts on chip increases, leading to greater design complexity. As a result, Metal ECO plays an important role in addressing last-minute ...
Semiconductor Engineering

Enabling Efficient Multi-Die Design Implementation and IP Integration

Many industry trends are driving chip developers to consider multi-die designs using advanced 2.5D and 3D technologies. Such designs enable incorporating heterogeneous and homogeneous dies in a single ...
Design-Reuse

Synplicity Launches ReadyIP Program: The Industry's First Universal, Secure IP Flow for FPGA Implementation

SAN JOSE, Calif.--April 15, 2008 --Synplicity®, Inc., a leading supplier of innovative IC design and verification solutions, today announced the ReadyIP Initiative, a program that takes aim at ...
DATAQUEST

Siemens collaborates with TSMC to accelerate 3D IC and AI-driven circuit and systems design

Collaboration with Siemens illustrates TSMC's persistent focus to enable shared customers for the latest and most advanced ...