The next big leap in semiconductor packaging will require a slew of new technologies, processes, and materials, but collectively they will enable orders of magnitude ...

The semiconductor industry has spent decades mastering the art of integrated circuit physical verification. But as system-on-chip (SoC) designs push the boundaries of complexity—with more transistors, ...

A new technical paper titled “Patterned Multi-Wall Nanosheet FETs for Sustainable Scaling: Zero Gate Extension With Minimal ...

A new technical paper (preprint) titled “Extreme Ultraviolet and Beyond Extreme Ultraviolet Lithography using Amorphous ...

Hardware Trojans Detection Using GNN in RTL Designs” was published by researchers at University of Connecticut and University ...

DAC's AI focus; 300mm fab report; foundry revenue; new auto chip org.; Micron earnings; rare earth exports plummet; UK's tech ...

An Agentic Approach for SoC Security Verification using Large Language Models” was published by researchers at University of ...

Disaggregration requires traffic cops and in-chip monitors to function as expected over time. The shift from SoCs to ...

Ensuring trusted execution across multiple chiplets and vendors is more complex than in traditional monolithic SoCs.

A new technical paper titled “Exploring optimal TMDC multi-channel GAA-FET architectures at sub-1nm nodes” was published by ...

Researchers from the University of Massachusetts Amherst created silicon-based in-sensor visual processing arrays that can ...

Just because the various components in an advanced package work individually and together doesn't guarantee they will work ...