Experienced high-speed PCB design and layout engineering is a major requirement for correctly partitioning a BGA on a PCB. Ideally, this expertise should be inextricably intertwined among chip vendors ...

Thanks to new production techniques, a dc-dc converter IC die and multiple components integrate into a more space-efficient power-management module. Semiconductor manufacturers have developed ...

Editor's note: This article addresses the need for designers of printed circuit boards for nextgen ICs to be savvy about package-on-package technology. New ways of working with sub-assembly printed ...

Abstract: The ball field design in a flip chip (FC) ball grid array (BGA) often becomes the determining factor for the package body size. This paper describes the physical definition of ball fields ...

IRONWOOD ELECTRONICS SG-BGA-6475 high performance BGA socket for 1mm pitch, 240 pin BGA IC’s is designed for IC size – 17x18mm package size and operates at bandwidths up to 27GHz with less than 1dB of ...

Abstract: Stacked die BGA has recently gained popularity in telecommunication applications. However, its board level solder joint reliability during the thermal cycling test is not as well-studied as ...

IRONWOOD ELECTRONICS GT-BGA-2135 BGA socket design uses high performance elastomer capable of 94GHz, suitable for very low inductance and wide temperature applications. Device is designed for 21x21mm ...

This application note focuses on printed circuit board (PCB) layout considerations for QFN and DQFN packages. This is intended for users who are familiar with PCB design, as well as, signal integrity ...