Abstract: Chiplets and 2.5D/3D integration schemes allow performance and yield beyond monolithic approaches. This tutorial covers advanced packaging technologies and the new capabilities they enable.
Abstract: 2.5D packaging supports high-speed data transmission, meeting performance requirements of GPU. However, signal integrity (SI) is a key challenge to packaging. This paper demonstrates a GPU ...
This software provides sample source code as a tutorial for applying the RGB (Red, Green, and Blue) hexagram, a visualization and multivariate analysis method, to 3D and higher-dimensional data. The ...
The involvement of plasmonics 1 in applications such as biosensing 2 through surface-enhanced Raman scattering (SERS), energy, 3 photodetectors 4 and lasers, 5 among others, is extensive because ...
On August 4, Powerchip Semiconductor Manufacturing Company (PSMC) unveiled the Logic-DRAM multi-layer wafer stacking technology and 2.5D interposers to meet rising AI demand. PSMC stated that major ...
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